• Novellus (SpeedFam-IPEC)

  
  • -Avanti 372M & 472
  • -AvantGaard 676 & 776
  • -Momentum
  • -Auriga & Auriga-C

• EBARA

  
  • -EPO222 & EPO Series
  • -FREX-200 Series
  • -FREX-300 / S I,II Series (300mm)

• Applied Materials

  
  • -Mirra+OnTrak/DNS Series
  • -Mirra+Mesa Series
  • -Reflexion / LK Series (300mm)

Greenspec Offers a Variety of Refurbishment Programs

ㆍCustomized to our customer’s particular needs

ㆍAvailable for all CMP models in semiconductor manufacturing

ㆍGlobal Customer Support Network

We focus on providing equipment and process solutions for all applications ofChemical Mechanical Planarization used in semiconductor manufacturing.

• ㆍReliable Quality
• ㆍReasonable Price
• ㆍOn-time Delivery

ㆍDrive to high performance and best results for customer satisfaction

ㆍProvide the solution point on specific problem

ㆍFluent skilled manpower and global network system for customer support

※F5x(SFX100,200) is useful for memory fab because it’s fast through-put, user-friendly interface, easy to change database and so on

ㆍF5x & FX100(200) can be changed to 200mm or 300mm by EFEM(handler system)

• ㆍSummit SW version: 4.9
• ㆍPC upgrade to over P4 computer
• ㆍLow Contact Chuck install
• ㆍXenon Blocker/UV cut-off filter : Modified for particle issue

PC upgrade Benefit

Item	P3	P4
CPU	850 MHz	2.4 GHz
HD	18GB	80 GB
RAM	512MB	1 GB
OS	NT	XP
Bus speed	133 MHz	800 MHz
Media	Jazz/Orb	DVD/USB

• 1. Faster boot time
• 2. Greater HD space for recipes & data
• 3. SW and RAM enable better multi-tasking

Low Contact Chuck Benefit

• 1. Decrease backside particle level
• 2. Decrease metal contamination
• 3. Eliminate wafer sticking on stage

※ OP series is very useful for logic & foundry fab, because combined measurement tools could be offered.

ㆍOP2600 and OP2600DUV : Fully refurbed system for 200mm

ㆍCustomer can choose the basic system or upgraded system

ㆍOP5240 : Fully refurbed system for 200mm

ㆍBased on Window NT and Pentium Ⅲ 1GHz

ㆍTFMS version: V2.1.R2 / V3.2R1SR3

ㆍMeasurement tool : BPR, BPE, Spectrometer, BB, SE, AE

※ Measures step height, via recesses, TIR (Total Indicator Runout)

• ㆍP20H: Long Scan Profiler with handler system

  Measurement of vertical features ranging from under 100Å to approximately 0.3mm, with a vertical resolution of 1 or 25Å.

  Handles wafers from 6” or 8” wafers

  

• ㆍP15/P16/P17: No handler system and manual measurement

  Based on Window NT(or XP) and Intel Pentium Ⅲ 1GHz

  Profiler Software version: 6.4 or 7.0

  

• ㆍHRP340: dual EFEM with 300mm handler

  HRP-Series offers high resolution, sensor stage and long-scan, sample stage profiling capabilities

  Based on Window XP and Intel PIV 2.8 GHz

  Profiler Software version: 7.2

  

※ Measures Implant Doses with TP or Sheet Resistance with RS

• ㆍTP(Therma Probe)

  The TP gives the user the capability of making a variety of measurements of Implant Doses rapidly on product wafers in a non-contacting and non-destructive manner

  The system uses 2 Lasers: a Pump Laser generates the Thermal Wave Signal and a Probe Laser serves as the 1 micron diameter signal probe

  

• ㆍRS

  From sheet resistance a lot of useful process information can be obtained

  : Resistivity, Film thickness, Film consistency, Other useful process information

  

Major CMP System Modify & Improvement Item List

AMAT CMP System

AMAT Mirra CMP 6 Inch Conversion Kit Development

AMAT Mirra CMP 6, 8 Inch Titan I Head Development

AMAT Mirra CMP Slurry Pump Modification ; Rotary Motor Type -> HICV & LFC Type

AMAT Mirra CMP Head UPA Modification Kit Development ; Head UPA Unit -> Central UPA Control Module Modification

AMAT Mirra-Ontrak CMP system FABS Modification ; Ergo Loader Type to Open Cassette Type.

AMAT Mirra CMP system NKS Head Motor Repair Service

AMAT Mirra CMP system Platen Motor Gear-Box Upgrade Service ; Alpa -> Yaskawa New Type

AMAT Reflexion CMP System Kollmorgen Head Motor Repair Service

AMAT Reflexion CMP System Yaskawa Platen Motor Repair Service

AMAT Reflexion CMP System MKS UPA Unit Repair Service (Plan)

AMAT Reflexion CMP System Platen Motor Gear-Box Overhaul Service

AMAT Reflexion CMP System Slurry Delivery Arm Overhaul Service

EBARA CMP System

EBARA EPO222 CMP System 6 Inch Conversion Kit Development

Ebara EPO222 CMP System 6 Inch Modified New I-Head Development

Ebara FREX200 CMP System Platen Wafer Slip Out Sensor Modification

Ebara FREX300S CMP System Rotary Joint Unit Overhaul Service (Plan)

SpeedFam-IPEC (Novellus) CMP System

Novellus 776 CMP Retrofit Installation

SLURRY MANIFOLD Improvement

CLEANER BRUSH UNIT(BU1,BU2) UPPER BRUSH BODY Improvement

BRUSH ROLLER ROTATE Detect SENSOR Modification

Wafer Rotate Detect Roller Unit Modification

BRUSH UNIT#1 HF FLOW METER BOX Modification

SRD Chuck Improvement & MOTOR & ENCODER CABLE Modification

POLISH UPPER RING Improvement

System Computer Upgrade

Novellus 776 CMP MP Head Cylinder Overhaul Service

• ㆍDevelop Modified Polisher Head

  Improved CMP head to increase uniformity on both the edge and entire surface of silicon wafers during mass production. It is specially designed for wafer suppliers to meet their customer’s production requirements for increased uniformity and quality versus current polishing equipment.

  
• • 1. Multi Zone Pneumatics(Merits for wafer Edge Polish Rate and uniformity)
  • 2. Membrane & Chuck Plate (Easy Maintenance)
  • 3. Clean Plastic materials for Guide Ring(Reduce Particles & increase Ring Life Time)
  • 4. Polish Head Gimbals Joint (Control Polish Head pressure)
  • 5. 3 zone Chuck Plate (Ease to change Membrane & retainer ring)
  • 6. 2 Zone Guide Ring ( Easy to change Guide Ring)
  • 7. Patent pending